SEA Deal Ticker
The AI chip bottleneck moves to Singapore: Powertech takes 30% of a $5.66B packaging venture
Powertech puts in $400 million for 30 percent of XCIP Technologies, a Broadcom joint venture in Singapore. Its fan-out panel packaging fits about 45 large AI dies per pass against eight or nine today. AMD ships first, in late 2027.
Positive-sum angle: Packaging is where AI chips actually queue. A second qualified site outside Taiwan shortens that queue for every fabless designer, not only for the client who paid to open it.