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Friday, 18 September 2026
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Korea's LG Innotek to build $1B semiconductor substrate plant in Vietnam's Hai Phong

The Q3 2026 groundbreaking anchors a 323,812-sqm plant making RF-SiP and FC-BGA packaging substrates — part of LG Group's $10.6B, seven-project push into Hai Phong.

Positive-sum angle: Advanced-packaging substrates made in Vietnam pull the AI-hardware supply chain south, handing local engineers and suppliers a seat at the 6G and AI-compute table.

Source — TechNode Global